Technology Metals / Refractory Metals

Key materials for high-tech industry: powders, compounds, semifinished products and customer-specific parts from tungsten, molybdenum, tantalum, niobium, rhenium, and their alloys.

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Advanced Ceramics

Fascinating materials for technology and medicine: powders and parts from aluminum oxide, aluminum titanate, silicon carbide, silicon nitride, zirconium oxide, further ceramic materials, and SOFC powders.

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AMPERIT® Thermal Spray Powders

Technologically advanced, high quality thermal spray materials for demanding applications in aerospace, automotive, oil & gas or power generation markets: carbides, oxides, MCrAlYs, molybdenum, metals and alloys.
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AMPERSINT® Atomized Metal Powders and Alloys
High-quality gas- and water atomized metal powders for innovative, future-oriented powder metallurgical applications.


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Recycling and Metal Processing Services

Tungsten, molybdenum, tantalum, niobium, and rhenium recycling. High-precision and CNC-controlled machines for customer-specific long forging, rolling and extruding of pure and alloyed materials.
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News:

News archive
Wednesday, 04/01/2015

H.C. Starck Increases Sales Despite Weak Market Development

Munich (Germany), April 2, 2015. H.C. Starck, one of the leading manufacturers of customer-specific powders and components made from technology metals and technical ceramics, performed well in 2014 given the very difficult market environment. The company increased its sales volume to 785.9 million euros in 2014 (2013: 703.9 million). As of December 31, 2014, the company reported 2,678 employees worldwide (2012: 2,843).
Tuesday, 03/17/2015

H.C. Starck Introduces MoNb and MoW Sputtering Targets at FPD China 2015

NEWTON, Mass., USA, March 17, 2015 – H.C. Starck is taking innovation to a new level with its hottest new sputtering alloys for Touch Screen Panel (TSP) applications. Curved and flexible touch screens are the latest in HDTV, smart phones, tablets and mobile device technology. Touch screens use H.C. Starck’s molybdenum-niobium (MoNb) targets to sputter thin films for barrier, capping and conducting layers in these devices.