CuMoCu: Copper-Molybdenum-Copper Laminates

Cu/Mo/Cu laminates developed by H.C. Starck have an adjustable coefficient of thermal expansion that can be correlated with a range of semiconductor substrates while simultaneously maintaining high thermal conductivity. These aspects make them a perfect choice for high power devices where significant heat is produced.

Cu/Mo/Cu laminates also have moderate thermal conductivity and low thermal and electrical resistance. They are suitable for Si-based devices as well as for large area power devices with significant heat generation.

Thermal Conductivity and Thermal Expansion-Mismatch

Thermal conductivity and the coefficient of thermal expansion-mismatch of a given die are some of the key parameters involved in selecting a heat spreader material. These two parameters can be calculated by introducing a Thermal Compatibility Factor for a given heat spreader material in a simple equation: (Heat Spreader) / A CTE (Die - Heat Spreader). The ensuing ratio may be utilized to assess the compatibility of a heat spreader material with a given die. A high compatibility factor results from a low coefficient of thermal expansion-mismatch and a high thermal conductivity value.

Thermal Management Materials and Components from H.C. Starck

Innovation and research are key components at H.C. Starck. As a worldwide leader in refractory metals we have state-of-the-art laboratories where we are constantly improving, refining and innovating our products and materials. H.C. Starck’s R&D programs are shaped by a constant dialogue with our customers. By listening to their needs and requirements, we strive to develop new and innovative products for the future of the thermal management industry.

H.C. Starck develops and manufactures thermal management components for HB-LEDs (High Brightness LEDs) and laser diodes, such as Mo-Cu composites, Cu/Mo/Cu laminates, and plated molybdenum and tungsten flat products. The reliability and efficiency of semiconductor devices can be improved by maximizing the thermal conductivity of the heat dissipating components, while matching their coefficients of thermal expansion (CTE) to those of the substrates.

We use finite element modeling as a computational tool to develop customized products for special applications that require effective heat removal under extreme conditions. Our advanced modeling capability enables us to address the needs of our customers by optimizing our current products or developing new products in a timely manner.

Additional products under development provide enhanced thermal conductivity along the z-axis (through-thickness) and the unique capability to tailor excessive heat dissipation along localized hot spots, using a special, patent pending process developed by H.C. Starck.