H.C. Starck has years of experience in producing premium, high performance molybdenum materials that provide suitable solutions to challenging applications in the electronics industry. The company’s advanced materials and technologies create value-added solutions for thermal management applications.

Custom-Engineered Thermal Management Materials

H.C. Starck develops custom-engineered thermal management materials, which are widely employed in the electronics industry. H.C. Starck’s engineered molybdenum composite materials, and laminates are customized for these applications.

The company produces materials that have high thermal conductivity and low and controlled coefficient of thermal expansion. These thermal management properties help in dissipating the heat from high power density devices. The engineering staff at H.C. Starck are expert in designing highly engineered materials that meet the exact needs of each application.

Advantages of H.C. Starck Materials

The materials offered exhibit superior thermal properties such as high thermal conductivity and low and controlled coefficient of thermal expansion. The high thermal conductivity of these materials facilitates the rapid removal of heat form high power density devices. With highly experienced engineering staff, H.C. Starck is well positioned to design highly engineered materials to meet the specific requirements of each application.

Molybdenum-Copper Composites

Molybdenum-copper is a composite material. It has similar thermal properties to the tungsten-copper composite, but its lower density makes it more suitable for applications where weight limitations are a factor.

Using a molybdenum skeleton and infiltrating it with copper, a variety of Mo:Cu ratios can be created to match the performance requirements of the application.

The standard ratio is: 70% Molybdenum: 30% Copper

Mo-Cu composite is available in the following forms:

  • Sheet material
  • Coils
  • Small parts in near net shape

Copper-Molybdenum-Copper Laminates (CuMoCu)

Cu/Mo/Cu laminates developed by H.C. Starck have an adjustable coefficient of thermal expansion that can be correlated with a range of semiconductor substrates while simultaneously maintaining high thermal conductivity. These aspects make them a perfect choice for high power devices where significant heat is produced.

copper_molybdenum_cumocu.jpgIn-plane Coefficient of Thermal Expansion, ppm/K

Cu/Mo/Cu laminates also have moderate thermal conductivity and low thermal and electrical resistance. They are suitable for Si-based devices as well as for large area power devices with significant heat generation.

Thermal conductivity and the coefficient of thermal expansion-mismatch of a given die are some of the key parameters involved in selecting a heat spreader material. These two parameters can be calculated by introducing a Thermal Compatibility Factor for a given heat spreader material in a simple equation: ? (Heat Spreader) / A CTE (Die - Heat Spreader). The ensuing ratio may be utilized to assess the compatibility of a heat spreader material with a given die. A high compatibility factor results from a low coefficient of thermal expansion-mismatch and a high thermal conductivity value.


Product brochures

  • Language
  • Тугоплавные металлы для термического контроля
    Refractory Metals for Thermal Management
  • ru

Product data sheet

  • Language
  • PDS number/_version
  • en
  • PD-7101_0