H.C. Starck has pioneered the development of two clad material systems, all of which use molybdenum as the primary constituent of the laminate. The major advantages of these structures are suitable Coefficient of Thermal Expansion (CTE), good thermal conductivity, high mechanical rigidity, corrosion resistance and superior adhesion characteristics when joining parts together.

These Ni / Mo / Ni laminates are differentiated from the Cu / Mo / Cu laminates when used in higher temperature processing, such as brazing, where superior adhesion characteristics are required.


  • CTE matched to semiconductor substrate
  • Excellent thermal conductivity
  • High volume production
  • Proven in high value applications
  • Approved for military and aerospace applications