H.C. Starck offers a diverse product portfolio of high performance, refractory metal solutions for thin film sputtering applications. H.C. Starck’s planar and rotary molybdenum (Mo) sputtering targets are manufactured for thin film transistor (TFT) applications. Molybdenum thin films are employed as barrier layers, electrodes, and wiring in flat panel displays (FPD) systems: HDTV, computers, monitors and mobile devices, for example, smart phones, table PC, digital recording devices, GPS, and other display systems, including latest technologies in OLED, QD, curved, and flexible displays, as well as advanced touch screen architectures.

H.C. Starck’s newest innovation is the new sputtering alloys DynaMoTM for Touch Screen Panel (TSP) display applications. Curved and flexible touch screens are the latest in HDTV, smart phones, tablets and mobile device technology. Touch screens use H.C. Starck’s molybdenum-niobium (MoNb) targets to sputter thin films for barrier, capping and conducting layers in these devices.

  • Enabling Cu and Al lines in TFT system and TSP systems
  • Solutions for LTPS, OLED and high resolution mobile platform
  • Barrier and capping layer

H.C. Starck’s molybdenum-tungsten (MoW) planar targets are applied when forming gate and touch sensor layers for TFT- LTPS and in-cell type touch panels.

H.C. Starck's DynaMoTM Alloys, the newest product line of molybdenum based alloys, showcases the company's ability to customize alloys for electrical performance, corrosion resistance and etch characteristics for higher reliability in TSP applications. These alloys feature large size capabilities with rotary targets up to 4100 mm long, planar targets up to Gen 5 in size as well as segmented (or tiled) targets.

Development of these innovative alloys is enabled by H.C. Starck's expertise in thin film characterization and ESBD analysis of textures and in refractory metal processing. Customized alloy development utilizes the unique processing of refractory metals, including powder metallurgy processing, high temperature rolling, extrusion and rotary forging.

H.C. Starck's largest planar sputtering target is the Gen 5.5 molybdenum plate featuring its expanded width of 1580 x 1950 mm. H.C. Starck produces molybdenum sputtering targets and machined targets for Gen 1 to 8 sputtering equipment configurations.

Committed to the research and development of thin films, H.C. Starck has invested in state-of-the-art laboratories for material processing and evaluation of thin films. Our facilities include a Thin Film Materials Lab equipped with planar and rotary sputtering tools along with the supporting equipment for film characterization. Customers benefit from in-house prototyping, modeling and analytical capabilities.

Highest Quality Sputtering Target Materials

H.C. Starck is one of the world’s largest producers of molybdenum, tungsten, tantalum and niobium metals, and fabricated products with a robust vertically integrated supply chain for supplying sputter targets for thin film coatings applications. Manufacturing facilities produce a broad range of sputtering target materials in all configurations.

  • Highest Quality Sputtering Materials
    • High Purity, Low Fe, Ni, Cr
    • Fully dense
    • Chemical and metallurgical uniformity
  • Planar Sputtering Targets
    • High purity
    • Dimensional precision and tight tolerance
  • Rotary Sputtering Targets
    • Extruded monolithic rotary target configurations
      • Highest powder densities and deposition rates
      • Extended target life and material utilization
    • Unitary sleeves for bonded rotary targets
    • Integrated manufacturing “under one roof”

Innovative Research and Development

Committed to the research and development of thin film products, H.C. Starck has a renowned research staff dedicated to advancing metals technology for refractory metal sputtering targets. To benefit customers, we continually invest and upgrade our advanced manufacturing and analytical capabilities. H.C. Starck’s evaluates planar and rotary sputtering targets in its Thin Film Materials Laboratory using thin film characterization instrumentation – complete with optical and electron microscopy. In our Material Processing laboratory, we produce evaluation targets with the assistance of a complete chemical analysis lab. Advanced material modeling and simulation capabilities support the rapid development of new products and processes at H.C. Starck.

  • Comprehensive thin film applications lab
    • Planar and rotary target deposition chambers
      • Co-Sputtering capability rapid composition optimization
      • Film resistivity testing
      • Reflectivity evaluation
      • Adhesion testing
    • Metallurgical laboratory
      • Optical microscopy
      • SEM with EDX and EBSD
      • Mechanical testing / hardness
    • Environmental chamber
      • Corrosion resistance
      • Evaluation of corrosion under electrical loading
    • Extensive analytical capabilities
      • IGA gas analysis
      • ICP
      • GDMS
  • Broad engineering and R&D staff
    • Recognized leader in refractory metal technology
    • Innovated texture control to enhance film uniformity and performance consistency
    • Hundreds of patents and technical publications
  • Materials Processing Laboratory
    • Powder processing
    • Rolling (Deformation)
    • Hot iso-static press
    • Thermal treatments

Vertically Integrated Supply Chain

H.C. Starck is vertically integrated with expertise in reducing, pressing and sintering high performance materials and finishing them for market. From its core competencies: molybdenum, tungsten, tantalum, and niobium, H.C. Starck offers highly engineered planar and rotary sputtering target materials for large area coatings.

The major flat panel display manufacturers value the high purity, density, uniform microstructure, and consistency of H.C. Starck’s materials, as well as the low resistivity, high power density, and superior sputtering performance.

H.C. Starck provides competent service and knowledgeable expertise to assist and guide our customers in choosing the best solution for all refractory metal applications with local support from over 30 locations worldwide.

For more information contact our application professionals by clicking the folder `Your Contact` on the right corner of this page.
  • Sputtering Targets for TFT-FPD application
  • Rotary and Planar Targets
  • Microstructure
  • EBSD

Refer to Product Data Sheets for Molybdenum:

PD-7040 PURE MOLYBDENUM Powder Metallurgy Target ST-100-1