TANTALUM PASTE - Ultraflat anode design for ultramodern capacitors

Tantalum's importance and relevance in industrial manufacturing are due to its unique properties, which make it a preferred material for high-performance applications. Tantalum is characterized by a very high density, good thermal and electrical conductivity and the fourth-highest melting point of all metals: 2,996 °C. Due to its ability to form an extremely thin but complete and protective oxide layer, it is outstanding for use in capacitor applications. Tantalum does not react with body tissues and fluids, so it is also suitable for use in medical implants and implantable medical electronics.

Maximum performance in the smallest space

With these properties, tantalum can be used to manufacture extremely small capacitors, which nevertheless have high capacitance. They basically enabled the trend toward thinner and thinner electronic devices in the first place, including products such as smartphones, tablet PCs, ultrabooks and other handheld devices, because ultraflat design is a key factor in the success of these lifestyle products. However, tantalum capacitors are also used in medical technology – such as in hearing systems or implantable medical electronics – and anywhere else that requires maximum performance within minimum space.

Tantalum paste that can be printed for use with ultrathin capacitors < 0.2 mm

Until now, the height of the anodes limited the height of the tantalum capacitors and, in turn, the height of the end devices. But thanks to a groundbreaking new product developed by H.C. Starck, now this height can be reduced even further: Our tantalum paste is stencil-printed onto a thin tantalum foil. This allows the production of ultraflat anodes, with which the height of the tantalum capacitors can be reduced to less than 0.2 mm. The ESR/ESL values have also been reduced, resulting in higher capacitor performance.

This technology can be used to manufacture tantalum capacitors with a higher energy density than aluminum capacitors, but with the same options for multianode design. In addition, it is possible to use alternative materials, such as niobium monoxide, and other processing methods.

Tantalum paste printing opens up innovative solutions for all applications in which anodes pressed from powder have reached their limits, e.g. in the latest trend toward embedded components.

The trend toward miniaturization with passive components continues unabated. H.C. Starck technology makes it possible to move in new directions when designing creative and multifunctional products for the electronics industry that are equally tailored to the needs of consumers and the business world. Our tantalum paste helps provide solutions for innovative product ideas in the field of consumer electronics and high-performance applications.

Our company and its tantalum processing sites are certified in the context of the Conflict-Free Smelter (CFS) Validation Program of the independent Electronics Industry Citizenship Coalition (EICC) and the Global e-Sustainability Initiative (GeSI).


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