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Tantalum Sputtering Target

TANTALUM SPUTTERING TARGETS

H.C. Starck is well-known as a major international producer of tantalum products for the electronic, semiconductor and industrial markets.

Tantalum ingots are electron beam (EB) melted, and have inherently high purity due to a combination of high vacuum settings, slow melting rates, multiple furnace passes, and careful control of all aspects of the process.

Application

Tantalum sputtering targets make thin coatings via a sputtering process for copper interconnect metallization, magnetic recording media, printer components, flat panel displays, optical and industrial glass, and thin film resistors.

Dimensions

H.C. Starck supplies both blanks and finished tantalum plates to manufacturers of sputtering targets. These targets meet exacting standards of purity and dimensional tolerances. Target blank sizes range from small research cathodes to large 100 pound planar targets. Typical thicknesses include .2" to .7", but thickness can be up to 1.5" and greater. Typical diameters are 3" to 18". Typical rectangles are 6" to 30" or larger based on customer needs.

Typical Tantalum Properties

H.C. Starck offers a variety of options for texture controlled plates that lead to uniform thin film deposition characteristics throughout the target life.

Electron beam (EB) melted, cross rolled, rolled and annealed:

Density: 0.6 lb/in3 or 16.6 g/cm3
Atomic Number: 73
Atomic Weight: 180.95
Purity: See chemistries below:


Elements
3N5 Purity
99.95% Ta
3N8 Purity
99.98% Ta

Max. ppm
Max. ppm
Al
10
5
Ca
10
5
Cl
3
3
Co
10
5
Cr
10
5
Cu
5
5
Fe
50
20
K
2
2
Li
1
1
Mg
10
5
Mn
10
5
Mo
50
20
Na
1
1
Nb
300
100
Ni
20
10
Pb
5
5
Si
10
10
Sn
10
5
Ti
10
5
V
5
5
W
150
100
Zn
5
5
Zr
20
10
Max Total
Detectable Metallics

500

200

INTERSTITIALS
C
40
40
O
100
100
H
10
10
N
40
20
S
10
10

Tolerances

Thickness:
Rolled and leveled plates have a normal thickness tolerance of ± 5% which can be tightened to ± .010" at an added cost, depending on dimensions required.

Flatness:
.005" - .010" TIR, depending on size and thickness

Grain Size:
ASTM 4 or finer for targets made from plates under .4" thick.

High Purity Tantalum Chemistries

There is a choice of purity levels with different prices and availability. Purity is measured by DC Plasma and gasses are measured by Leco analyzers. More detailed testing by GDMS (Glow Discharge Mass Spectrometry) is available.

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Water jet cut edge
(cut tolerance +0.060" - 0")

Sheared edge
(cut tolerance +1/8" - 0")
 
Water jet cut (top) and machined edge
(tolerance ±.010")

Conflict-free, Sustainable Tantalum Supply

H.C. Starck only processes raw materials from ethically acceptable, conflict-free sources. This also applies for the procurement and processing of tantalum. We only purchase raw materials that meet the specifications of the OECD ("Due Diligence Guidelines for Supply Chains of Minerals from Conflict-Affected and High-Risk Areas"). Our company and its tantalum processing sites are certified in the context of the Conflict-Free Smelter (CFS) Validation Program of the independent Electronics Industry Citizenship Coalition (EICC) and the Global e-Sustainability Initiative (GeSI).

Downloads:

Product brochures

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  • High Performance Solutions in Thin Film Materials
    高機能ソリューション 薄膜材料
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  • Fabricated Products High Performance Solutions
    高性能ソリューション
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